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PRODUCTS

Semiconductor Equipment

TGV(Through Glass Via)

TGV(Through Glass Via)
LIST

Features

  • Production verified Laser Structuring system

  • Get unrivaled processing speeds and yields

  • Can maintain high positional accuracy

  • Respond to market demand for glass sizes

Specification

Laser Type

Ultra Short Pulse Laser

Accuracy

±5㎛ (3 sigma)

Product size

≤510x515㎟

Product thickness

≤2.0t

Main function

Capable of concurrent multi-diameter hole fabrication and intricate cavity processing

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