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PRODUCTS

半导体设备

TGV(Through Glass Via)

TGV(Through Glass Via)
LIST

产品特征

  • 经过量产验证的激光结构化系统(Laser structuring system)

  • 独特的加工速度和良率保障

  • 可保持高精度位置(±10微米@4西格玛)

  • 能够满足市场对玻璃尺寸的需求(510 x 515平方毫米 @1.1毫米厚度)

产品规格

Laser Type

Ultra Short Pulse Laser

Accuracy

±5㎛ (3 sigma)

Product size

≤510x515㎟

Product thickness

≤2.0t

Key Features

Capable of concurrent multi-diameter hole fabrication and intricate cavity processing

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