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PRODUCTS

半导体设备

Glass Singulation

Glass Singulation
LIST

产品特征

  • 用于提升基板完整性的下一代聚合物去除解决方案

  • 提升良率与可靠性的创新玻璃核心加工技术

  • 用于精密玻璃核心检测的先进多层同步成像技术

产品规格

Laser Type

Ultra Short Pulse Laser

Accuracy

±10 um

Product size

≤510 x 515 ㎟

Product thickness
(with Polymer)

≤3t

Key Features

Fp to Qp, QP to Unit

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